Samsung lands Broadcom AI chip deal worth more than $200 billion through 2030
At a technical level, the deal is built around closer integration between Broadcom's ASIC designs and Samsung's manufacturing stack. Broadcom's next-generation communications chips will be produced using Samsung's sub-2-nanometer process, putting them at the leading edge of chip scaling, where efficiency and heat management are becoming increasingly challenging.
Read Entire Article
What's Your Reaction?
Like
0
Dislike
0
Love
0
Funny
0
Angry
0
Sad
0
Wow
0
